TEL 2180-02129-V1 PCB board

TEL 2180-02129-V1 PCB board        

Product Details Introduction

TEL 2180-02129-V1 PCB board product features

beginning

TEL 2180-021229-V1 PCB board is suitable for semiconductor equipment dedicated circuits, with precise process and stable performance, and can adapt to long-term continuous operation conditions of the equipment.

The substrate is made of high TG board, which is resistant to high temperatures and has no delamination or bubbling during reflow soldering

High precision etching of the circuit, wide line spacing for fine lines, suitable for precision component mounting

Copper foil has strong adhesion and is not easily peeled off in high and low temperature environments

Uniform and thick copper plating on the hole wall to prevent oxidation and circuit breaking inside the hole during long-term use

Precise impedance control to reduce high-frequency signal loss and crosstalk interference

Improve the grounding copper laying design to effectively suppress electromagnetic noise interference

Dense arrangement of thermal conductive vias, quickly exporting the working heat of components

Excellent insulation performance, high and low voltage lines meet safety isolation standards

Surface immersion gold process, anti-oxidation, stable welding yield without virtual welding

Low coefficient of thermal expansion in size, not easily deformed or displaced in temperature changing environments

Through wet heat and salt spray testing, it has strong durability against moisture and corrosion

Adequate mechanical strength, resistance to vibration and impact, and less likely to be damaged during equipment operation

The solder mask coating is uniform and complete, preventing short circuits and scratches on the circuit

Clear and standardized silk screen markings facilitate maintenance and component assembly

Compliant with lead-free RoHS standards, environmentally friendly and compatible with the factory requirements of the entire machine

ending

TEL 2180-02129-V1 PCB board combines electrical, heat resistance, and mechanical properties, making it a reliable supporting circuit board for semiconductor equipment.

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