Daihen RMN-20K3-V RF Automatic Matcher

Daihen RMN-20K3-V RF Automatic Matcher        

Product Details Introduction

Daihen RMN-20K3-V RF Automatic Matcher

Daihen RMN-20K3-V is compatible with semiconductor etching and thin film plasma chambers

20kW high-power 13.56MHz impedance automatic matching, suitable for load balancing conditions

Fast matching adjustment speed, stable plasma arc initiation without power reflection

Built in high-precision power sampling, real-time monitoring of incident and reflected power

Water cooled cooling structure, controllable temperature rise during long-term full power operation

Built in multiple protections for over power, over temperature, and standing wave ratio exceeding the standard

Standard communication interface, capable of linking RF power supply and equipment master control

Internal precision adjustable capacitor and inductor module, with a wide matching range

Automatically and quickly track and adjust parameters when the impedance of the cavity fluctuates

The shell is designed to be clean and dust-proof, meeting the standards for use in dust-free workshops

Fault code self check, quickly locate matching circuit abnormalities

Whole machine shielding structure, suppressing RF interference from peripheral boards

Universal interface for RMN modules in the same series, easy to replace and disassemble

Factory process calibration, no need for complex parameter debugging on the machine

Integrated compact body, saving equipment cabinet installation space

In summary, the Daihen RMN-20K3-V RF automatic matching device has high matching efficiency and complete protection, and is the core RF matching component of high-power plasma process equipment

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