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  • Advanced Energy 3153137-934 Remote Plasma Source
  • Advanced Energy 3153137-934 Remote Plasma Source
  • Advanced Energy 3153137-934 Remote Plasma Source
Advanced Energy 3153137-934 Remote Plasma Source Advanced Energy 3153137-934 Remote Plasma Source Advanced Energy 3153137-934 Remote Plasma Source

Advanced Energy 3153137-934 Remote Plasma Source

Advanced Energy 3153137-934 Remote Plasma Source 

Product Details Introduction

Advanced Energy 3153137-934 Remote Plasma Source

Introduction: Advanced Energy 3153137-934 is a remote plasma source specifically designed for semiconductor etching and cavity cleaning. It can efficiently excite process gases to generate plasma, ensuring stable wafer processes. Its core features are as follows:

Uniform RF energy output, continuous and stable plasma generation, no instantaneous power fluctuations

Remote excitation design, keeping plasma away from the wafer to avoid substrate ion damage

Built in impedance automatic matching circuit, quickly adapting to different process gas working conditions

Multiple safety protections, automatic interlocking shutdown for over temperature, over standing wave, and over power

Suitable for various cleaning gases such as fluorine and oxygen, with high efficiency in removing by-products from the chamber

Integrated water-cooled heat dissipation structure, controllable temperature rise during long-term full load operation

Equipped with a digital communication interface, it can remotely control power and gas ratio parameters

The cavity is made of corrosion-resistant special alloy material, which is resistant to process gas erosion

Low harmonic RF output to reduce electromagnetic interference from surrounding equipment in the workshop

Built in multiple sets of process formula storage, no need for repeated debugging when switching cleaning programs

Real time status self check, quick identification of fault codes for abnormal gas sources and circuits

Standard flange installation interface, can directly connect to semiconductor process chamber pipelines

Soft start power output, reducing instantaneous high voltage impact loss on internal components

The whole machine is sealed and dust-proof, meeting the standards for use in dust-free semiconductor workshops

Original factory compatible with various thin film deposition and dry cleaning semiconductor production equipment

Conclusion: Advanced Energy 3153137-934 has high plasma excitation efficiency and long service life, and is a core supporting equipment for semiconductor cavity cleaning process.

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PMA53R-00100-00NKTU117P21NRLC-LSS-NS-03
PMA53Q-10100-00AMAT 0110-00001N31HRLJ-LNK-NS-01
PMA53Q-00100-00IMASO0157160001-PE DSDI 126
PMA45R-11100-0270 AS 32a-E57160001-BH DSTD 110
PMA45R-01100-00AMAT 0100-71282PFTL201C 20.0KN
PMA45R-00100-00IMHSS02M21NSXC-LNN-NS-02
PMA45Q-10100-00AMAT  0100-20078P21NRXB-LNN-NS-00


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