KAWASAKI 3NS004S-C008 Robot Laser Module
Product Details Introduction
KAWASAKI 3NS004S-C008 Robot Laser Module
beginning
KAWASAKI 3NS004S-C008 is a Class 1 laser alignment module specifically designed for Kawasaki Semiconductor wafer robots. It integrates laser detection and chip pre alignment functions and is used for edge positioning correction of silicon wafers, adapting to dust-free wafer transfer equipment.
Class1 safe laser light source, used in dust-free workshops without radiation safety hazards
High precision laser sensing detection with minimal control of chip alignment angle error
Compatible with 300mm standard wafers, compatible with various substrates such as quartz and silicon wafers
High speed alignment calculation, fast completion speed of single chip calibration
Integrated optical path and signal acquisition, compact module structure
Built in photoelectric isolation circuit to isolate electromagnetic interference from robot motors
Multiple static electricity and overcurrent protection to avoid the risk of wafer static electricity damage
Clean grade stainless steel shell, dustproof and corrosion-resistant, suitable for vacuum chamber
Dedicated communication interface, directly connected to Kawasaki wafer robot main control system
Real time output of alignment offset data, coordinated with mechanical arm compensation coordinates
Low power optical path design, long-term continuous operation with low temperature rise
Equipped with a status indicator light, quickly identify laser and sensor faults
Customizable alignment parameters to adapt to different process chip requirements
Standardized buckle installation, disassembly and replacement without disassembling the cavity
Independent channel self-test function, automatically verifies laser output intensity when powered on
ending
KAWASAKI 3NS004S-C008 robot laser module has precise alignment, cleanliness and safety, and is the core component of semiconductor wafer handling robot chip pre alignment.
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