TEL Tokyo Electron 308-500221-1 Fiber Interface Board

TEL Tokyo Electron 308-500221-1 Fiber Interface Board

Product Details Introduction

TEL Tokyo Electron 308-500221-1 Fiber Optic Interface Board is a high-speed fiber optic communication interface board used in Tokyo Electron semiconductor equipment, mainly responsible for fiber optic data transmission within the equipment or between external systems. It supports high bandwidth, low latency data communication and is widely used in process control systems, image processing modules, remote diagnostics, and other applications that require high real-time performance.

The following is a detailed explanation of the product's application areas (without patterns):

1、 Basic Information

Product model: 308-500221-1

Product Name: Fiber Optic Interface Board

Manufacturer: Tokyo Electron Ltd. (TEL)

Function category: Communication/Data Transmission Module

Board type: High speed digital signal transmission board (photoelectric conversion type)

2、 Main functions

Fiber optic data transceiver interface

Realize the mutual conversion between electronic signals and optical signals;

Supports single-mode or multi-mode fiber optic input and output for high-speed data exchange.

High speed communication bridge between devices

Establish high-speed connections between the main controller and remote modules such as image processing units, vacuum controllers, and RF power control units;

Avoid the risk of traditional cable signals being interfered with in complex industrial environments.

Data synchronization and real-time feedback

Provide a low latency communication mechanism to ensure that the system response time meets the precision requirements of semiconductor processes;

Support data integrity verification and clock synchronization mechanism.

Safety and electrical isolation

By utilizing the natural electrical isolation properties of optical fibers, high voltage interference or surge propagation between devices can be prevented;

Reduce the failure rate of device communication interfaces.

3、 Typical application scenarios

TEL etching equipment (Etcher)

High speed optical communication for high-frequency RF control signals or cavity status feedback with the main control system.

CVD/ALD and other deposition systems

Connect remote control modules (such as temperature control system, reaction gas module) for parameter data synchronization.

Image recognition system or sensor array

Transmitting high-resolution images or positional data, such as for wafer alignment and image matching control.

Communicate with the upper MES/monitoring system

In a multi device collaborative environment, device level data transmission is achieved through fiber optics to improve the overall level of factory automation.

Product imag

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