TEL Tokyo Electron BX81-000006-14 Communication Module

TEL Tokyo Electron BX81-000006-14 Communication Module

Product Details Introduction

The TEL Tokyo Electron BX81-000006-14 communication module is one of the key communication interface boards in the Tokyo Electron semiconductor equipment system, mainly used to achieve high-speed data communication between various control units inside the equipment or with the upper system. The following is a detailed product application field description of this module (without patterns):

1、 Basic Information

Product model: BX81-000006-14

Product Name: Communication Module

Manufacturer: Tokyo Electron Ltd. (TEL)

Module Type: Communication Interface Board/System Bus Communication Module

2、 Product Features

Communication bridge between systems

Used for high-speed communication between internal controllers of devices, such as main control CPU boards, I/O modules, sensor interface boards, etc;

It can also serve as an interface board for communication between TEL devices and upper management systems (such as hosts, SECS/GEM systems).

Industrial communication protocol support

May support RS-232, RS-422, RS-485, CAN, TTL, Ethernet, or TEL proprietary communication protocols (depending on specific device configuration);

Real time transmission of command data, process parameters, control signals, status information, etc.

Synchronization and timing management

Implement synchronous signal transmission during process execution, such as Start signal, Ready signal, Done signal, etc;

Support clock synchronization between systems, process status feedback, and other functions.

Communication stability and electrical isolation

Strong anti-interference ability and electrical isolation design to ensure the stability of communication links;

Support CRC verification, retransmission mechanism, link monitoring and other functions.

3、 Typical application areas

This module is typically used in the following TEL series devices or subsystems:

Dry etching equipment (Etchers)

Connect the main controller with gas control, RF power module, vacuum chamber control unit, etc;

CVD/ALD deposition system

Communication control between temperature control unit, vacuum control, and wafer system;

Lithography machine auxiliary system

Implement communication between the exposure module, image processing board, and servo motion platform;

Cleaning and conveying equipment (such as EFEM/Load Port)

Used for command communication and status feedback between systems or MES data systems;

SECS/GEM communication interface (such as through dedicated adaptation)

Support external communication standard protocols to achieve data exchange with the central system of the production line.

Product imag

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