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  • TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane
  • TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane
  • TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane
TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane

TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane

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  • Delivery date: stock
  • The quality assurance period: 365 days
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TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane

Product Details Introduction

The TEL Tokyo Electron SVB-20MVE-ADV2 signal bus backplane is a high-performance backplane module used for inter module communication and electrical connections within Tokyo Electronics (TEL) semiconductor equipment. It mainly serves as a communication platform and power distribution center for multiple functional boards. It constitutes the "backbone channel" of the device electronic system and is of crucial importance for the stable operation of the overall control system.


1、 Basic Product Information

Project Content

Product Name: Signal Bus Backplane

Product model SVB-20MVE-ADV2

Manufacturer Tokyo Electron Ltd

Module type Backplane communication and power interface platform


2、 Main functions

Signal transmission platform


Provide a unified data bus structure to achieve efficient signal exchange between multiple functional modules;


Support unified routing of digital signals, analog signals, and control signals.


Modular interface support


Design with multiple standard slots (such as VME, CPCI, etc.), supporting direct insertion of control cards, I/O cards, monitoring modules, etc;


Each slot has standardized signal/power interfaces, ensuring plug and play and easy maintenance.


Power distribution and protection


The backplane integrates power rails internally, which can provide stable power supply of different voltage levels (such as ± 12V,+5V,+3.3V) for multiple boards;


Simultaneously equipped with power overcurrent/short circuit protection mechanism to enhance the overall reliability of the system.


3、 Application Fields

Semiconductor equipment control system


The central control architecture used in TEL's adhesive development, etching, cleaning, heat treatment and other equipment;


Carrying multiple functional units such as control CPU board, I/O module, temperature control card, communication interface, etc.


Process automation control platform


As the main communication carrier in a multi board collaborative system, maintain a high bandwidth and high stability signal channel;


Support real-time response and multitasking in complex action processes.


Equipment maintenance and modular expansion


Easy to replace or expand functional boards without requiring significant changes to the device structure;


It is one of the essential structural components in the long-term operation of equipment.

Product imag

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