Daihen AMN-50E6-V RF Matching Module

Daihen AMN-50E6-V RF Matching Module        

Product Details Introduction

Daihen AMN-50E6-V RF Matching Module

Introduction: Daihen AMN-50E6-V is a specialized 60MHz 5kW automatic RF matching device for TEL etching/deposition machines, which achieves precise matching of RF power supply and 50 Ω impedance of cavity plasma.

Rated 60MHz high-frequency, 5000W high-power output, suitable for copper process plasma chambers

High speed automatic impedance tuning, fast elimination of reflected power, high RF transmission efficiency

Built in precision servo capacitor tuning mechanism, continuous and stable matching under load fluctuations

Integrated multiple RF safety protections including standing wave, overcurrent, overtemperature, and detuning

All metal enclosed air-cooled shell, large area heat dissipation holes, no high temperature for a long time under full load

Standard industrial communication interface, directly connected to the main control of the machine to achieve remote parameter control

Real time collection of forward/reflected power data, uploaded to the upper computer for monitoring plasma status

Optoelectronic isolation signal circuit to resist strong radio frequency electromagnetic interference in the workshop

Original factory standard docking port, non-destructive replacement compatible with TEL series semiconductor equipment

Thickened RF copper foil circuit, low loss conduction, reduces RF heating loss

Seismic reinforcement of internal components to withstand long-term continuous vibration conditions of the machine

Clean and dust-proof whole machine process, meeting the standards for use in semiconductor dust-free workshops

Equipped with a fault code indicator light, it can quickly locate abnormalities such as misalignment and overheating

Strong and weak electrical zoning layout, with no crosstalk between RF signals and control circuits

Factory full load RF aging, standing wave linkage full calibration test

Conclusion: Daihen AMN-50E6-V has fast matching response, low RF loss, stable maintenance of uniform plasma in the cavity, and significantly reduces process fluctuations and production line downtime.

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