TEL Tokyo Electron 3208-000171-13 Controller Module

TEL Tokyo Electron 3208-000171-13 Controller Module

Product Details Introduction

The TEL Tokyo Electron 3208-000171-13 controller module is an embedded control core component specifically designed for Tokyo Electronics (TEL) semiconductor manufacturing equipment. It is mainly used to manage and coordinate the operational logic of various subsystems in the equipment, perform key functions such as process flow control, data acquisition and processing, and communication scheduling. It is one of the brains of the entire equipment.

1、 Product Overview

Project Content

Product Name Controller Module

Product model 3208-000171-13

Manufacturer Tokyo Electron Ltd

Function type: Central logic control and task scheduling

2、 Core functions

Main control logic processing

Embedded industrial grade CPU or FPGA control unit, responsible for running the main control program of the equipment;

Manage system tasks such as temperature control, pressure regulation, sensor acquisition, and action logic.

Data collection and communication interface

Multi channel signal interaction with analog input modules, digital output modules, IO boards, PLC subsystems, etc;

Supports internal communication protocols and external interfaces of TEL devices (which may include RS-232/485, Ethernet, CAN, etc.).

Process management

Execute the preset process sequence to ensure precise connection of equipment actions in each stage;

Support parameterized settings, automated control, anomaly detection, and alarm response.

3、 Typical application areas

Coater/Developer

Control the rotation speed of the glue coating, the movement of the arm mechanism, the transportation of the developer solution, heating/cooling, and other actions.

Etching and deposition equipment (Etcher/CVD/ALD)

Manage the linkage logic between gas processes, plasma power, temperature control systems, and vacuum chambers.

Wafer handling system

Coordinate the actions of vacuum chamber doors, robotic arms, lifting platforms, etc., to achieve precise transfer of wafers from one process unit to the next.

Product imag

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